THE UNITED STATES
A diverse R&D and manufacturing powerhouse
With 14 customer support sites, two factories and three R&D centers, ASML in the US is an important development and manufacturing hub serving global chipmakers such as Intel
The US at a glance
With R&D and manufacturing centers on the West and East Coasts, and offices near all our local customers such as Intel, the United States plays an integral part in helping to advance ASML’s holistic lithography product portfolio.
Customer support centers
“In order to be successful, my job requires me to think outside the box, inside the box, and everywhere in-between.”
Electrical engineering team lead
San Diego, California
ASML compensation and benefits in the US
13 paid holidays
Paid vacation and sick days
Performance-based variable pay plan
Long-term incentive plan for outstanding performance
Employee share purchase plan
401(k) retirement savings plan with matching employer contribution
Comprehensive health and welfare benefits package
Employee referral bonus
Long-time service award
Vacation sell-back program
Relocation assistance, available for certain roles
Training and development opportunities, including educational assistance through our Global Training and Studies
Our technology in the US
Our regional expertise is as diverse as our landscape, offering a multitude of technical challenges and growth opportunities. Whether its exploring fundamental physics, chemistry and computer science problems to pioneer new technology or perfecting world-class products, the diverse, multi-disciplinary US teams do it all.
A completely magnetically levitated stage accelerates at more than 15 g, more than three times the g-force experienced by a fighter jet pilot at takeoff, up to a constant velocity of more than three meters per second. It positions the chipmaker’s reticle (blueprint of the chip pattern) within fractions of nanometers in all six degrees of freedom at full speed.
EUV light source
The droplet generator is the heartbeat of the EUV light source, delivering a steady stream of 50,000 liquid tin droplets per second, which fly at more than 241 kilometers per hour in a vacuum vessel. Each droplet – whose size is a fraction of the thickness of a human hair – is individually imaged and targeted by two high-power CO2 laser pulses, generating a plasma that emits EUV light.
Today’s chips have billions of transistors, built up layer by layer with extreme precision, requiring the imaging of tens of billions of patterns that must be simulated and optimized within 24 hours – it’s an enormous, time-sensitive task. We harness the power of tens of thousands of computing cores to quickly process full chip blueprints – all without sacrificing accuracy.